P8060: Copper Bump Developer

The P8060 Copper Bump Developer was designed specifically for developing dry laminated film resist.

The high capacity heat exchanger allows process solution temperature to remain constant ± 2.0˚C and achieving up to 40˚C for long constant spray develop cycles often required by thick laminated films.  The heat exchanger can control the developer temperature to four process modules simultaneously for maximum flexibility and throughput.  C&D’s pressure tanks can interface with a bulk delivery system that dilutes the developer from a concentrate. This dilution system mixes and fills the canisters without track interruption saving time and money.

The high performance spindle motor along with customer specific spray nozzles, stepping motor controlled raster arm, and constant flow and temperature control of developer all optimize CD control. The raster arm movement capability is a proven method for the copper bump process.

The digital high performance stepper motor is key to achieving center to edge uniformity.

High Capacity Manufacturing

The P8060 Copper Bump Developer is capable of high capacity manufacturing. With four process modules able to run simultaneously, the system throughput is maximized. C&D offers a variety of spray nozzles to choose from for customer specific spray fan patterns often required for dry films. The developer flow rate and pressure are fully adjustable.

C&D’s proven software platform is a perfect fit for the Copper Bump process. The component exercise mode allows the user to optimize and to test spray patterns, supply pressure, and developer flow.

System Features