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C&D Semi Data Sheet (PDF)
Download C&D Semi SVG Data Sheet (PDF)SVG: Round and Square Wafer Substrates
The SVG 8X system is capable of processing 3” – 6” wafers. The SVG 88X has the capability of dual wafer size bridging without any hardware change.
The SVG 86X belt transfer system works well for square or rectangular substrates while the SVG 88X transfer arms provide minimal contact with the backside of the wafer. SVG 86X can run 2” – 6 substrates and the SVG 88X can run 2” – 8” substrates.
Coater
The SVG 88X coater comes standard with pivoting dispense and three (3) dispense capability with an optional fourth dispense. It also comes standard with top and bottom edge bead removal (EBR).
Additional options include:
- Resist temperature control
- Exhaust flow control
- Vapor prime module
- Dual chamber vapor tip bath
- C&D Recipe Master
- Submicron Coat (SMC)
- Dual wafer size bridging without any hardware change
The C&D Low Turbulence catch cup is designed to greatly reduce the exhaust flow requirement by up to 60% thereby delaying resist drying and virtually eliminating the chance of particulate generation in the Cup. The upper section of the Cup is specific to each wafer size which assures the exhaust flow will be optimized for a given wafer size.
Developer
The SVG 88X developer comes with either a stationary or moving dispense system and single or dual dispense capability. Additional options include:
- Constant temperature control
- Exhaust flow control
- C&D Recipe Master
- Flood Expose capability
- Dual wafer size bridging without any hardware change
The SVG 8X track systems can be equipped with a Hot Plate Oven (HPO) or multiple HPOs and chill plates.