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C&D Semi Data Sheet (PDF)


P7000: Low cost high throughput Metal Alloy System

The C&D P7000 Alloy track system, primarily used for GaAs and InP wafers, is capable of processing 2” – 6” wafers.

Metal ohmic alloying is unique to the compound semiconductor industry and is therefore often ignored by major equipment manufacturers. The process is carried out on platforms that were not originally designed for alloying.

C&D Semiconductor has come up with a cost-effective solution by developing a custom modified multiple hotplate coat track system that meets the specific needs of metal ohmic alloying.

The advantages of the C&D Alloy System are simplicity, high throughput, no wafer backside contact with the hot plate, low warpage, and high reliability.

The P7000 track system can be equipped with either a PC control system or card cages. The PC control provides added capabilities such as expanded recipes, manual exercise mode, and data logging.

  • Closed chamber inert atmosphere capability – eliminating need for Rapid Thermal Annealing (RTA)
  • Capable of using multiple gases with pump out capability
  • Up to 500° C thermal process capability
  • Proximity pins for uniform heating and reduced backside contamination
  • Gentle wafer cooling and handling
  • Process 50 mm to 200 mm wafers
  • High throughput at a fraction of the cost of a Rapid Thermal Annealer (RTA)
  • Optional dual size bridging without hardware changeover
  • Minimal backside contact

Temperature ramping is achieved by varying the wafer up-down moving speed, which controls the wafer-to-hotplate distance. The wafer is placed on three pins that can be programmed to raise and lower at a specified rate. This helps to reduce wafers from warping.

An adjustable flow of nitrogen is applied to the wafer for a variable amount of time through programming. This ensures that the wafer is cool enough before being transferred to the chill plate and then to the receive cassette.