Wafer Sorter
S4000 Tabletop Sorter
The S4000 Wafer Sorter is a two cassette benchtop system with an impressive 34” x 45” footprint. The system has cassettes in a symmetrical layout which allows a dual end effector robot to transfer wafers at high speed between the cassettes via the pre-aligner and OCR station.
Prior to wafer sorting the cassettes are automatically mapped to determine occupied and empty slots as well as cross slot wafers. After cassette mapping the sorter transfers the wafer based upon the criteria within the recipe. Sorting can be conducted using wafer slot position or Wafer ID as the critical move factor.
The Wafer Sorter uses state of the art OCR technology for reading the ID mark on a wafer. The OCR system is capable of reading alphanumeric laser scribes, T7 dot matrix or barcodes all without any hardware changeover or recipe modifications. Read rate is typically greater >99%.
It is also possible to include multiple cameras on a wafer sorter should a customer require reading of scribes on the topside and bottom side of the wafer.
The S5010 is a recipe-driven, high-throughput wafer sorting system with an efficient radial footprint. The system can process wafers between 100mm and 200mm, at the speed of >350 wafers per hour (WPH) when reading laser marks and 750 WPH when transferring between cassettes. It boasts an impressive 10,000 hours Meantime Between Failures and 10,000 cycles Mean Wafers Between Assists.
Key Features
- Intuitive graphical user interface simplifies the complex wafer sorting functions into four easy-to-operate operations: sort, split, merge, and wand.
- Cassette mapping automatically detects and displays the presence/absence of wafer in each slot and wafer state.
- Support for OCR, M12, M13, T7, and Barcode
- Uninterrupted Power Supply (UPS) ensures continuous operation even in the event of a power outage
- Vacuum reservoir
- High-precision pre-aligner
- Dual end effector for maximum throughput
- Linear accuracy ±0.0025mm
- Circular accuracy ±0.05°
- CE mark certifies the system’s compliance with EU requirements
Options
- SECS/GEM integration
- Wafer thickness measurement
- Dual-size bridging
- 2, 3, or 4 cassette stations
- 3rd Party data sorting on data generated from other process tools
- SMIF 200mm
- SMIF and open (on same tool) 200 mm