Spin Coater & Developer
P8060 Copper Bump Developer
The P8060 Copper Bump Developer is a high-capacity system specifically designed for developing dry laminated film resist. The system features four simultaneous process modules, a variety of customer-specific spray nozzles, and fully adjustable developer flow rate and pressure. Its component exercise mode allows the operator the flexibility to test and optimize spray patterns, supply pressure, and developer flow prior to production runs.
The high performance spindle motor along with customer specific spray nozzles, stepping motor controlled raster arm, and constant flow and temperature control of developer all optimize CD control. The raster arm movement capability is a proven method for the copper bump process.
Key Features
- Ability to process 50mm – 200mm substrates
- High-capacity heat exchanger can control temperature on four process modules simultaneously for maximum flexibility and throughput.
- Component exercise mode makes it easy to perform system maintenance and troubleshooting
- Intuitive software application for easy recipe creation
- Upgraded ATS arms for improved repeatability
- CE mark certifies the system’s compliance with EU requirements
The high capacity heat exchanger allows process solution temperature to remain constant ± 2.0˚C and achieve up to 40˚C for long constant spray develop cycles often required by thick laminated films. The heat exchanger can control the developer temperature to four process modules simultaneously for maximum flexibility and throughput. C&D’s pressure tanks can interface with a bulk delivery system that dilutes the developer from a concentrate. This dilution system mixes and fills the canisters without track interruption saving time and money.
Option
- SECS/GEM