Frame Processing Systems
P8030 Automatic Frame Processing System
The P8030 Frame Processing System is a software-controlled, pre-saw wafer coating and post-saw wafer cleaning system. The system features a high-performance spindle motor and high-precision stepper motor and can be operated in either auto or manual mode for thin wafers of different frame sizes.
C&D’s P8030 holds a proven track record of gently cleaning wafers post saw or laser scribing, including its capability of handling solvent or caustic cleans.
Key Features:
- Ability to process 50mm–200mm substrates
- Cassette mapping
- Atmospheric central robot
- Custom-made counter-balance chuck for different frame/wafer sizex
- C&D’s unique counter balance chuck allows for various types of frames, wafer sizes, and overall weight of the frame and substrate. The chuck can be fabricated out of several
types of material to best suit the customer’s process. The chuck design supports sawn substrates and prevents small die from being pulled down by vacuum. - Ability to coat very thin wafers
- Ability to clean wafers after sawing or laser scribing
- A powerful, easy-to-use software package
- The P8030 system operating console provides the system an easy to use and friendly user interface
The system has the capability to capture various system data and present them on the screen as reports. The reports are organized into six major categories:
- Alarm report
- Event report
- Batch report
- Session report
- Wafer lost report
Process programming is simple. The program screen allows you to view, modify, add, or delete process programs in very few and simple steps.