Alloy/Anneal Systems
The P7000 Alloy System
The P7000 Alloy System is a modified multi-hotplate track system specifically tailored for the needs of metal ohmic alloying. The system is primarily designed for the processing of 50mm– 200mm GaAs and InP wafers. It features engineering simplicity and ease of use and is a cost-effective alternative to the expensive Rapid Thermal Annealing (RTA), offering roughly twice as much throughput.
Key Features
- Up to 500° C thermal processing capability
- Capability to use multiple gases with pump out
- Proximity pins for uniform heating and reduced backside contamination
- Gentle wafer cooling and handling effectively reduces wafer warping
- Upgraded ATS arms for greater repeatability
- Minimal backside contact
- High throughput at a fraction of the cost of a Rapid Thermal Annealer (RTA)
- Optional dual-size bridging without hardware changeover
- CE mark ensure full compliance with EU safety, health, and environmental requirements
Temperature ramping is achieved by varying the wafer up-down moving speed, which controls the wafer-to-hotplate distance. The wafer is placed on three pins that can be programmed to raise and lower at a specified rate. This helps to reduce wafers from warping.
An adjustable flow of nitrogen is applied to the wafer for a variable amount of time through programming. This ensures that the wafer is cool enough before being transferred to the chill plate and then to the receive cassette.